I. General Information
Major code: 7480108PT
Training level: Undergraduate
Graduation Degree: Engineer
Training duration: 4.5 years (9 semesters)
Graduation requirements: Students are considered for graduation recognition when meeting all the following conditions:
- Accumulate a sufficient number of courses and program volume reaching 172 credits;
- The cumulative grade point average (CPA) of the entire course reaches 2.0 or higher;
- Achieve foreign language proficiency level 4 according to the 6-level Foreign Language Proficiency Framework for Vietnam;
- Possess certificates in National Defense - Security Education and Physical Education;
- Not being prosecuted for criminal liability or not currently under disciplinary action at the level of academic suspension.
II. Admission Combinations
Combination based on High School Exam scores & High School Academic Results (Academic transcripts):
|
IV. Employment Opportunities and Postgraduate Study Capability
1. Objectives
Training engineers in Computer Engineering Technology – Semiconductor IC Packaging and Testing major who possess political qualities, ethics, professional responsibility, and a sense of community service; possessing knowledge, professional practice skills, and research capacity commensurate with the training level; possessing good health, well-meeting labor demands in the period of international integration and the Fourth Industrial Revolution.
Vietnam - Korea University of Information and Communications Technology, The University of Danang trains Semiconductor IC Packaging and Testing Engineers who:
- PO1. Have good professional ethics;
- PO2. Have the ability to read/write documents in English; have the ability for basic English communication; have the ability to present/report scientific issues in English; possess teamwork skills.
- PO3. Have basic knowledge of natural sciences and social sciences.
- PO4. Have comprehensive, deep, and advanced knowledge in the field of Computer Engineering Technology, especially the assembly and test process of microchips (ATMP);
- PO5. Have the ability to research, solve problems, and provide expert conclusions in the field of Computer Engineering Technology.
2. Expected Learning Outcomes
Graduates of the Computer Engineering Technology training program - Semiconductor IC Packaging and Testing major have the ability to:
a. PLO1. Have the ability to perceive ethics and professional and community responsibility;
- PI1.1 Be honest in work.
- PI1.2 Possess a sense of responsibility toward work.
- PI1.3 Comply with technical regulations, processes, and safety rules in an industrial manufacturing environment.
b. PLO2. Communicate and work in teams effectively;
- PI2.1 Present and deliver presentations (in Vietnamese) on issues effectively.
- PI2.2 Draft documents and reports (in Vietnamese) with structures complying with regulations.
- PI2.3 Work in teams effectively.
c. PLO3. Possess critical thinking, creative thinking, and entrepreneurial spirit;
- PI3.1 Have the capacity to critique the opinions of others.
- PI3.2 Propose technical improvement solutions that meet the practical requirements of the manufacturing process.
- PI3.3 Build a startup project proposal.
d. PLO4. Have the ability to use foreign languages in communication and in the field of Computer Engineering Technology;
- PI4.1 Use foreign languages to present issues in the field of Computer Engineering Technology.
- PI4.2 Have the ability to use foreign languages in communication.
e. PLO5. Apply knowledge of natural sciences, social sciences, computer science, and Computer Engineering Technology to solve basic problems;
- PI5.1 Apply knowledge of natural sciences, computer science, and Computer Engineering Technology to solve basic problems.
- PI5.2 Apply knowledge of social sciences into practical work.
f. PLO6. Have the ability to apply processes, techniques, and tools to analyze, design boards, and simulate microchip packaging solutions;
- PI6.1 Analyze and design printed circuit boards (PCBs) and substrates that meet the signal transmission requirements of microchips.
- PI6.2 Deploy and optimize packaging processes for semiconductor components (from basic to advanced such as SiP, 3D IC) that meet industrial standards.
g. PLO7. Have the ability to build scenarios, program, and operate automated semiconductor component testing systems;
- PI7.1 Proficiently use programming languages and specialized software to control measurement equipment and automated test equipment (ATE) systems.
- PI7.2 Design and deploy test programs to evaluate the functionality, performance, and reliability of microchips before factory shipment.
h. PLO8. Have the ability to research and propose solutions for failure analysis, quality evaluation, and troubleshooting in semiconductor production lines;
- PI8.1 Perform failure analysis processes on microchips; propose troubleshooting measures in the assembly and testing process.
- PI8.2 Propose quality assurance and quality control (QA/QC) processes to optimize the productivity and reliability of semiconductor products.
IV. Cơ hội việc làm và khả năng học tập sau đại học
1. Employment Opportunities
Graduates from the Computer Engineering Technology – Semiconductor IC Packaging and Testing major can perform tasks such as:
- Test/Verification Engineer: Program, design test hardware (Loadboard/Probe card), and operate Automated Test Equipment (ATE) systems at microchip corporations.
- Packaging Engineer: Design, develop, and optimize IC packaging solutions at OSAT factories or foundries.
- QA/QC & Failure Analysis Engineer: Evaluate reliability, analyze physical/electronic causes of component failures, and control production line quality.
- PCB design and development engineer, embedded system engineer in electronic technology and automation enterprises.
- Researchers and lecturers in training institutions and research institutes for computer engineering and semiconductor technology.
2. Postgraduate Study Capability
Possess foundational knowledge in the Computer Engineering Technology major to develop new knowledge and be able to continue studying at the master's and doctoral levels in Computer Engineering Technology, Information Technology, Electronic Engineering, Semiconductor Technology, and other closely related majors.
